NDT Systems BondHub Multimode Imaging Bond Tester

NDT Systems BondHub Multimode Imaging Bond Tester

NDT Systems BondHub Multimode Imaging Bond Tester

The new BondHub imaging system interfaces with the outputs from a standard Bondascope 3100 and connects to any of our manual or automatic scanners with dedicated imaging software preloaded, to generate high-resolution C-scan images in Pitch-catch, MIA and Resonance modes. Featuring a large sun-readable LCD screen, high speed CPU and storage, the BondHub is built into a robust Pelican style case for easy set-up and transportation and even acts as storage case for the Bondascope 3100, probes and cables (sold separately).

Full Battery Operation:
The BondHub is battery operated making inspections possible in almost any location. A quick release keyboard and mouse are standard for practical operation.

Advanced Image Analysis:
The CompVue software displays the live signal from the Bondascope in the Phase and Amplitude Impedance plane. Once a scan is defined, the system automatically generates the C-scan image in real-time. Various alarms and gates can be used including new color gating for depth analysis in resonance mode. Phase, Amplitude and a special Additive display can be displayed as variables. Analysis tools including defect sizing, jog to position, post processing of gates and reporting can be used, before being exported by USB.

bondhub-c-scan-imaging

Features:

  • Portable, battery operated system with large sun-readable LCD screen
  • C-scan Imaging using Resonance, Pitch-Catch and Mechanical Impedance (MIA) modes
  • Connects directly to Bondascope 3100 and manual or automatic scanners
  • Easy interpretation
  • Increased probability of detection
  • Digital Archiving of results
  • Pitch-catch and MIA modes require no couplant
  • More consistent and reliable results
  • Reduced effect of human error on results
  • Increased speed of inspection
  • Compatible with other manufacturer's bond testers


Applications:

  • Integrity of composites and adhesively bonded structures
  • Multi-layered laminates, glass fiber / carbon fiber composites, honeycomb and foam cores, metal to metal bonding, adhesively bonded fittings.
  • Delaminations, disbonds, crushed core, skin to core flaws, far-side defects, impact damage, liquid ingress and more


Standard BondHub Kit Includes:

  • BondHub integrated in Pelican style case
  • 12" sun-readable LCD display
  • Batteries
  • AC Charger
  • User Manual
  • Windows 7, 1GHz processor, 128GB solid state HDD
  • CompVue Software
  • Keyboard and mouse


Optional Accessories:

  • Resonance Probes
  • MIA probes
  • Pitch-Catch Probes
  • Protective Carrying Case
  • Bondascope 3100 and cables
  • Manual and Automatic Scanners


Specifications:

Operating Modes: Pitch-Catch, Mechanical Impedance (MIA), Resonance.
Display Modes: C-scan - Phase, Magnitude or Additive view
Impedance plane (flying dot) - Direct representation of bond tester
Strip chart - rectangular real-time streaming of outputs
Display Analysis: Retrace position of all dots acquired
Flaw sizing - length, area
Changeable gates in post processing, Save scan plans, user setups, etc..
Auto and user defined scaling, mm/inch units, move scanner to position
Image & Data Output: BMP, JPG, PNG, XLS
Compatible Scanners: Manual Scanners: StringScan, SlideScan
Automatic Scanners: CrosScan, TunnelScan
Alarms / Gates: Box, ring, sectorial individually sizeable gates. LED and audible alarms.
Power Source: 2 Li-Ion Batteries (4-5 hrs.) or AC mains
Operating Temperature: 15°F to 158°F (-10°C to 70°C)
Dimensions: 7.5" x 18" x 14" (191 x 457 x 356 mm) (H x W x D)
Weight: 25 lbs. (11 kg.)


Product Literature

Description Part # Saved Price Select Option Add to
BondHub Bond Testing C-Scan Imaging Bond Tester BT-NDT-BONDHUB
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