NDT Systems BondHub Multimode Imaging Bond Tester

NDT Systems BondHub Multimode Imaging Bond Tester

The One-Stop-Shop for all Composite Inspection Needs


The new BondHub II Imaging System interfaces with the outputs from a standard Bondascope 3100 and connects to manual or automatic scanners, such as the CrosScan, to measure bond strength in composite material. The Bondascope 3100, Probes, and Scanners must be purchased separately. 

The BondHub II consists of a computer, scanner drivers,  displays, and CompVu Imaging Software. The CompVu Software generates high-resolution C-Scan images in Pitch-Catch, MIA, and Resonance modes that allow for even further analysis. This system is designed with versatility in mind: use the BondHub in any inspection of composite material testing, in any location, and with probes & scanners from other manufacturers. 


Requisite Components for C-Scan Imaging

The BondHub is only one of three components necessary to create C-Scan images. The Bondascope 3100, Bondhub, and Scanner (in this case, the CrosScan Automatic Scanner) work together to create the C-Scan image. The Bondascope 3100 sends live readings from the CrosScan, which traverses the Composite Material, to the Bondhub, where the C-Scan image is created via the CompVu Interface in MIA, Pitch-Catch, or Resonance readings--depending on Probe Type. Probes, scanners, and Bondascope must be bought separately. Click here for the Bondascope 3100 purchasing and here for the CrosScan.


  • Battery Operated For Increased Portability 
  • C-scan Imaging using Resonance, Pitch-Catch and Mechanical Impedance (MIA) modes
  • Increased probability of detection
  • Digital Archiving of results
  • Pitch-catch and MIA modes require no couplant
  • Compatible with other Manufacturers Bond Testers




Bond Testing Modes in CompVue Software

Once a scan is defined, the system automatically generates the C-scan image in real-time. Various alarms and gates can be used including new color gating for depth analysis in resonance mode. Phase, Amplitude and a special Additive display can be displayed as variables. Analysis tools including defect sizing, jog to position, post processing of gates and reporting can be used, before being exported by USB.

Mechanical Impedance Analysis (MIA)

  • Measure of how much a structure resists motion when subjected to a harmonic force and displays as signal amplitude and phase changes


  • Easy calibration and requiring no couplant, Pitch-Catch method results are easy to interpret to find good and bad bonds


  • Detects disbonds in skin-to-skin joints or in inter-ply delamination in composite structures



The BondHub II was designed with the ever-evolving field of Material Composite Research in mind.  Its modularity makes it compatible with other manufacturers probes and  scanners--both automatic and manual. This modularity, combined with its CompVue software ensures that you are testing with the best, whatever your application. It has been depended upon in the Aviation, Material Composite R&D, and Industrial Piping industries. For more information on which mode suits your application needs, consult the Bond Test Mode Selection Guide

Comparative Testing 
  • Compare readings from other testing to ensure accuracy
  • Immediately generate report for auditing purposes and proof of inspection
Defect Detection and Interpretation
  • Determine the grade of composite defects as well as the defect size

Technical Specifications

BondHub II

BondHub II
Operating Modes: Pitch-Catch, Mechanical Impedance (MIA), and Resonance all within the scope of CompVu Software
Display Modes: C-scan - Phase, Magnitude or Additive view
Impedance plane (flying dot) - Direct representation of bond tester
Strip chart - rectangular real-time streaming of outputs
Display Analysis: Retrace position of all dots acquired
Flaw sizing - length, area
Changeable gates in post processing, Save scan plans, user setups, etc..
Auto and user defined scaling, mm/inch units, move scanner to position
Image & Data Output: BMP, JPG, PNG, XLS
Frequency Range: 250Hz to 1.5MHz
Connector Type: USB, DVI, Multi-pin scanner connector
Processor: 1GHz
Memory:  128GB Solid State Drive
Operating System: Windows 7
Peripherals: Mini-Keyboard with Trackpad and Separate Mouse
Display Type: Color TFT LCD sun readable 1200nit
Display Size: 800 x 600 pixels, 12.1in. (307mm) diagonal
Scanner Compatibility: Manual Scanners (StringScan, SlideScan) and automated scanners (CrosScan, TunnelScan)
Compatible Probe Types (Pitch-Catch): Spring loaded or fixed tips
Tone burst, pulsed or high voltage option
Low, medium or high frequency
Compatible Probe Types (Mechanical Impedance): 1/4”, 3/8”, 1/2” tip dia
Compatible Probe Types (Resonance): 18kHz, 26kHz, 53kHz, 110kHz,
165kHz, 200kHz, 250kHz, 280kHz,
330 kHz, 370 kHz
Alarms / Gates: Box, ring, sectorial individually sizeable gates. LED and audible alarms.
Power Source: 2 Li-Ion Batteries (4-5 hrs.) or AC charger (110-240V)
Operating Temperature: 15°F to 158°F (-10°C to 70°C)
Case Construction: Integrated in Pelican Style case, vibration isolation
Dimensions: 7.5" x 18" x 14" (19.1 x 45.7 x 35.6 cm) (H x W x D)
Weight: 25 lbs. (11 kg)
Certification: Factory Calibration
Warranty: 1 year

Kit Includes

  • BondHub integrated in Pelican Carrying Case
  • Mouse & Keyboard
  • Factory-Installed Windows 7 license
  • Factory Installed Internal Li-Ion Battery Packs
  • AC Charger
  • Bondascope 3100-BondHub Connection Cable (Bondascope 3100 must be bought separately)
  • Operator Manual
  • Custom-Made Packaging

Product Literature

Description Part # Saved Price Select Option Add to
NDT Systems BondHub Bond Testing C-Scan Imaging Bond Tester BT-NDT-BONDHUB Request Pricing