| Description | Part # | Saved | Price | Select Option | Add to |
|---|---|---|---|---|---|
| NDT Systems BondHub Bond Testing C-Scan Imaging Bond Tester | BT-NDT-BONDHUB |
|
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The new BondHub II Imaging System interfaces with the outputs from a standard Bondascope 3100 and connects to manual or automatic scanners, such as the CrosScan, to measure bond strength in composite material. The Bondascope 3100, Probes, and Scanners must be purchased separately.
The BondHub II consists of a computer, scanner drivers, displays, and CompVu Imaging Software. The CompVu Software generates high-resolution C-Scan images in Pitch-Catch, MIA, and Resonance modes that allow for even further analysis. This system is designed with versatility in mind: use the BondHub in any inspection of composite material testing, in any location, and with probes & scanners from other manufacturers.
The BondHub is only one of three components necessary to create C-Scan images. The Bondascope 3100, Bondhub, and Scanner (in this case, the CrosScan Automatic Scanner) work together to create the C-Scan image. The Bondascope 3100 sends live readings from the CrosScan, which traverses the Composite Material, to the Bondhub, where the C-Scan image is created via the CompVu Interface in MIA, Pitch-Catch, or Resonance readings--depending on Probe Type. Probes, scanners, and Bondascope must be bought separately. Click here for the Bondascope 3100 purchasing and here for the CrosScan.
MIA
Pitch-Catch
Resonance
Once a scan is defined, the system automatically generates the C-scan image in real-time. Various alarms and gates can be used including new color gating for depth analysis in resonance mode. Phase, Amplitude and a special Additive display can be displayed as variables. Analysis tools including defect sizing, jog to position, post processing of gates and reporting can be used, before being exported by USB.
The BondHub II was designed with the ever-evolving field of Material Composite Research in mind. Its modularity makes it compatible with other manufacturers probes and scanners--both automatic and manual. This modularity, combined with its CompVue software ensures that you are testing with the best, whatever your application. It has been depended upon in the Aviation, Material Composite R&D, and Industrial Piping industries. For more information on which mode suits your application needs, consult the Bond Test Mode Selection Guide.
| BondHub II | |
| Operating Modes: | Pitch-Catch, Mechanical Impedance (MIA), and Resonance all within the scope of CompVu Software |
| Display Modes: | C-scan - Phase, Magnitude or Additive view Impedance plane (flying dot) - Direct representation of bond tester Strip chart - rectangular real-time streaming of outputs |
| Display Analysis: | Retrace position of all dots acquired Flaw sizing - length, area Changeable gates in post processing, Save scan plans, user setups, etc.. Auto and user defined scaling, mm/inch units, move scanner to position |
| Image & Data Output: | BMP, JPG, PNG, XLS |
| Frequency Range: | 250Hz to 1.5MHz |
| Connector Type: | USB, DVI, Multi-pin scanner connector |
| Processor: | 1GHz |
| Memory: | 128GB Solid State Drive |
| Operating System: | Windows 7 |
| Peripherals: | Mini-Keyboard with Trackpad and Separate Mouse |
| Display Type: | Color TFT LCD sun readable 1200nit |
| Display Size: | 800 x 600 pixels, 12.1in. (307mm) diagonal |
| Scanner Compatibility: | Manual Scanners (StringScan, SlideScan) and automated scanners (CrosScan, TunnelScan) |
| Compatible Probe Types (Pitch-Catch): | Spring loaded or fixed tips Tone burst, pulsed or high voltage option Low, medium or high frequency |
| Compatible Probe Types (Mechanical Impedance): | 1/4”, 3/8”, 1/2” tip dia |
| Compatible Probe Types (Resonance): | 18kHz, 26kHz, 53kHz, 110kHz, 165kHz, 200kHz, 250kHz, 280kHz, 330 kHz, 370 kHz |
| Alarms / Gates: | Box, ring, sectorial individually sizeable gates. LED and audible alarms. |
| Power Source: | 2 Li-Ion Batteries (4-5 hrs.) or AC charger (110-240V) |
| Operating Temperature: | 15°F to 158°F (-10°C to 70°C) |
| Case Construction: | Integrated in Pelican Style case, vibration isolation |
| Dimensions: | 7.5" x 18" x 14" (19.1 x 45.7 x 35.6 cm) (H x W x D) |
| Weight: | 25 lbs. (11 kg) |
| Certification: | Factory Calibration |
| Warranty: | 1 year |
| Description | Part # | Saved | Price | Select Option | Add to |
|---|---|---|---|---|---|
| NDT Systems BondHub Bond Testing C-Scan Imaging Bond Tester | BT-NDT-BONDHUB |
|
Request Pricing | ||
