NDT Systems Bondascope 3100 Multimode Bond Tester

NDT Systems Bondascope 3100 Multimode Bond Tester

Composite & Adhesion Bond Analysis for Any Application

Overview

The Bondascope 3100 is a portable ultrasound Bond Tester that uses 3 different testing modes to cover a range of material inspection. Operating typically between 20kHz - 400kHz, the lower frequency enables deeper penetration through materials, across multiple glue lines and even sandwich cores to detect far-side defects. It's testing modes utilize Pitch-catch, Mechanical Impedance Analysis (MIA), and Resonance inspection for test samples. All other manufacturers’ probes may be used in conjunction with the Bondascope 3100. The Bondscope 3100 works with the BondHub II  and Scanners to create high-resolution C-Scan images.

  

Requisite Components for C-Scan Imaging

The Bondascope 3100 is only one of three components necessary to create C-Scan images. The Bondascope 3100, Bondhub, and Scanner (in this case, the CrosScan Automatic Scanner) work together to create the C-Scan image. The Bondascope 3100 sends live readings from the CrosScan, which traverses the Composite Material, to the Bondhub, where the C-Scan image is created via the CompVu Interface in MIA, Pitch-Catch, or Resonance readings--depending on Probe Type. Probes, scanners, and BondHub must be bought separately. Click here for the Bondascope 3100 purchasing and here for the CrosScan.

Features

  • Operating Modes: Resonance, Pitch-Catch, Mechanical Impedance (MIA)
  • Display Modes: RF, Impedance Plane, Flying Dot, Sweep, Time-Encoded Profile
  • Pulser modes: Tone burst, high energy pulsed mode, swept frequency
  • Programmable user setups
  • Auto-Probe Recognition and Probe Library
  • Alarm Modes: Amplitude and Phase
  • Compatible with Probes from Other Manufacturers

Probe & Bond Test Mode Selection Guides

As noted above, one of the defining features of the Bondascope 3100 is its universal Probe acceptance and automatic recognition. As a result, Probe selection is extensive. Please consult the following Probe Guide when researching and deciding on your probe needs.

Going hand in hand with Probe Selection, deciding on a Bond Test Mode is of equal importance. Consult the Bond Test Selection Guide to supplement your application research. 

 

 

Inspection Modes of the Bondascope 3100

When a probe is connected to the Bondascope 3100, the automatic recognition optimizes the settings for the probe type. There are 6 inspection methods available:

  1. Pitch-Catch RF:  Transmits a short burst of acoustic energy to the part and measures the amplitude and phase change of the received signal directly. A disbond reduces sound attenuation into the part leading to a higher amplitude at the receiver.
  2. Pitch-Catch Pulsed: Transmits a spike pulse of broadband acoustic energy into the part and measures the amplitude of the received signal.
  3. Pitch-Catch Swept: Transmits a short burst of acoustic energy to the part across a pre-defined swept frequency range. The system measures the amplitude and phase change of the received signal.
  4. MIA Fixed Frequency: Probe tip driven at fixed frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change. This is related to the stiffness of the bond.
  5. MIA Swept Frequency: Probe tip driven with a swept frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change.
  6. Resonance: Probe driven at the resonance frequency and the damping caused by contact with the part is analyzed. Defects are identified by a change in the phase and amplitude of the probe resonance caused by a change in acoustic impedance of the part.

Results can be displayed in different modes including live RF envelope or impedance plane display. A time-encoded profile of phase and amplitude can also be used for rapid scanning. Finally, a C-Scan image will be generated when the BondaScope is used in conjunction with the BondHub II. 

There is a range of probes available for each inspection method and the system is compatible with probes from other manufacturers for added functionality.

Applications

The Bondascope 3100 excels at composite material testing. Its design allows any probe to be used to measure any test. The field of Bond Testing, and by extension, Material Science, is broad--which is why the Bondascope 3100 is designed to accept virtually any bond testing probe. It is adaptable to any virtually any situation where material integrity is concerned. Let's define some of the areas where the Bondascope 3100 analysis excels:

  • Integrity of honeycomb or foam cored composites
  • Adhesively bonded metal-to-metal structures and fittings
  • Multi-layered glass or carbon fiber laminates
  • Material defects from the manufacturing process such as material stress & fatigue, material temperature/pressure/humidity exposure, and impact damage
  • Nature of defects detectable are delamination, disbonds, crushed core, skinto-core flaws, far-side defects, impact damage, and liquid ingress

Finally, if used in conjunction with the BondHub II, 3D or C-Scan imaging can be performed on any of the above listed applications.

Technical Specifications

Bondascope 3100

Bondascope 3100
Display: 240 x 320 pixels, quarter-VGA, 5.7"(14.4mm) diagonal EL
Power source:  Field-replaceable Li-ion battery (autonomy = 8 hours) or AC power
Operating Temperate: 32 F - 105 F (0 °C to 40 °C)
Storage Temperature: -4 F - 140 F (-20 °C to 60 °C)
Connector Type: Standard 11-pin Fischer & 8-pin Lemo (compatible with probes of other manufacturers)
Connectivity: Connectivity
Probe Type Frequency: Pitch-Catch (tone burst, pulsed & swept frequency) | MIA (fixed & swept frequency) | Resonance 250Hz - 1.5MHz (probe and setup specific) | adjustable frequency, adjustable cycles
Gate Type Display Modes: Up to 8 independent rectangular, elliptical or circular shaped gates in impedance plane mode RF, Impedance plane (flying dot, swept mode), Profile mode
Probe Types: Pitch-Catch:
Spring loaded or fixed tips
Tone burst or pulsed and high voltage option
Low, medium or high frequency		 Mechanical Impedance:
1/4”, 3/8”, 1/2” tip dia
(6.35mm, 9.53mm,
12.70mm)		 Resonance:
Standard- 110kHz, 165kHz, 200kHz,
250kHz, 280kHz, 330 kHz, 370 kHz.
Honeycomb- 18kHz, 26kHz, 53kHz
Dimensions: 5.75 x 9.5 x 3.0in (14.6 x 24.1 x 7.6cm)
Weight: 5lbs (2.27kg)

Kit Includes 

  • Bondascope 3100
  • Instrument
  • Li-Ion battery pack
  • AC charger

 

  • Data Transfer Package
  • Hard-Shelled Carrying
  • Manual
  • Certificate of Calibration

Product Literature

Description Part # Saved Price Select Option Add to
NDT Systems Bondascope 3100 Hand Held Bond Tester BT-NDT-BOND-3100-PKG
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