NDT Systems Bondascope 3100 Multimode Bond Tester

NDT Systems Bondascope 3100 Multimode Bond Tester

NDT Systems Bondascope 3100 Multimode Bond Tester

The Bondascope 3100 is a handheld, battery operated ultrasound bond tester that uses 3 different testing modes to cover a range of applications. Operating typically between 20kHz - 400kHz, the lower frequency, compared to conventional testings, enables deeper penetration through attenuating materials, across multiple glue lines and even sandwich cores to detect far-side defects. The different display modes are optimized for different applications with a variety of gates and alarms to easily identify a flaw.

Features:

  • Resonance, Pitch-catch and Mechanical Impedance modes
  • Programmable user setups
  • Auto-Probe recognition and probe library
  • RF Impedance plane display mode
  • Time encoded bond profile display mode
  • Reference display mode
  • Alarm modes: Amplitude and Phase. Halo, square and ellipse ring gates
  • Tone Burst, high energy pulsed mode and swept frequency mode
  • Individually sizeable "ring" gates with alarms
  • Compatible with probes from other manufacturers
  • Splitcan and Splitview

Multimode Operation:
The most common Pitch-catch (P/C) and Resonance modes are suited to laminates, bonded and sandwich structures. Pitch-catch is dry coupled, easy to use and works well on larger defects, >0.5". Resonance mode requires couplant but can identify smaller defects and even determine which layer the defect occurred in with multi-layered bonded structures.
Mechanical Impedance Analysis (MIA) mode is dry coupled and most suited to metal-to-metal bonding and stiffer skin to core constructions. It has less penetration but works well on irregular and curved surfaces and with the small tip can accurately position the location of the defect.

6 Inspection Methods:

When a probe is connected to the Bondascope 3100, the automatic recognition optimizes the settings for the probe type. There are 6 inspection methods available:

Pitch-Catch RF:
Transmits a short burst of acoustic energy to the part and measures the amplitude and phase change of the received signal directly. A disbond reduces sound attenuation into the part leading to a higher amplitude at the receiver.

Pitch-Catch Pulsed:
Transmits a spike pulse of broadband acoustic energy into the part and measures the amplitude of the received signal.

Pitch-Catch Swept:
Transmits a short burst of acoustic energy to the part across a pre-defined swept frequency range. The system measures the amplitude and phase change of the received signal.

MIA Fixed Frequency:
Probe tip driven at fixed frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change. This is related to the stiffness of the bond.

MIA Swept Frequency:
Probe tip driven with a swept frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change.

Resonance:
Probe driven at the resonance frequency and the damping caused by contact with the part is analysed. Defects are identified by a change in the phase and amplitude of the probe resonance caused by a change in acoustic impedance of the part.

Results can be displayed in different modes including live RF envelope or impedance plane display. The impedance-plane display (flying dot or swept) is a polar coordinate system showing the phase shift and amplitude of the test area compared to a nulled out good bond. A time-encoded profile of phase and amplitude can also be used for rapid scanning.

There is a range of probes available for each inspection method and the system is compatible with probes from other manufacturers for added functionality.

bondascope-3100-probe-modes


Applications:

  • Multi-layered laminates
  • Skin to core flaws
  • Glass fiber / carbon fiber composites
  • Far-side defects
  • Honeycomb and foam cores
  • Impact damage
  • Metal to metal bonding
  • Adhesively bonded fittings
  • Liquid Ingress


Standard Bondascope 3100 Kit Includes:

  • Bondascope 3100 Hand Held Bond Tester
  • Pelican style shipping case
  • User Manual
  • Battery
  • AC Charger
  • Calibration Certificate


Optional Accessories:

  • Resonance Probes
  • MIA Probes
  • Pitch-Catch Probes
  • Protective Carrying Case
  • Battery external charger and conditioning unit
  • Data Transfer Kit with cable (optional)



Specifications:

Operating Modes: Pitch-Catch: tone burst, pulsed and swept frequency
Mechanical Impedance (MIA): fixed and swept frequency; Resonance.
Display Modes: RF, Impedance plane (flying dot, swept mode), Profile mode
Display: 240 x 320 pixels, quarter-VGA 5.7" (14.4mm) diagonal high bright EL
Probe Connector: Standard 11-pin Fischer & 8-pin Lemo (compatible with probes of other manufacturers)
Frequency Range: 250Hz - 1.5MHz probe and setup specific-adjustable frequency, cycles
Alarms: Box, polar and up to 8 individual and individually sizeable "ring gates" centered at stored reference dot locations in impedance plane operation. Positive or negative operation.
Storage: 100 setups and 250 screens with real-time date and time stamp
Power Source: Field-replaceable Li-Ion Battery (8-10 hrs.) or AC mains
Operating Temperature: 15°F to 105°F (-10°C to 40°C)
Probe Types: Pitch-Catch:
Spring loaded or fixed tips
Tone burst or Pulsed
Low, medium or high frequency
High voltage option
Mechanical Impedance:
1/4", 3/8", 1/2" tip diameter
(6.35, 9.53, 12.70 mm)
Resonance:
Standard - 110kHz, 165kHz, 200kHz, 250kHz, 280kHz, 330kHz, 370kHz
Honeycomb - 18kHz, 26kHz, 53kHz
Dimensions: 9:25" x 5.5" x 2.9" (235 x 140 x 74mm) (H x W x D)
Weight: 5 lbs. (2.26 kg.) including battery

Product Literature

Description Part # Saved Price Add to
Bondascope 3100 Hand Held Bond Tester BT-NDT-BONDASCOPE-3100 Request Pricing