NDT Systems Bondascope 350 Dual Mode Bond Tester
The Bondascope 350 is super compact and lightweight handheld, battery operated ultrasonic bond tester that used 2 different testing modes to cover a range of applications. Operating typically between 20kHz - 400kHz, the lower frequency, compared to conventional ultrasonic testing, enables deeper penetration through attenuating materials, across multiple glue lines and even sandwich cores to detect far-side defects. The different display modes are optimized for different applications with a variety of gates and alarms to easily identify a flaw.
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- Pitch-Catch and Resonance Modes
- Programmable user setups
- Automatic probe recognition and probe library
- RF Impedance plane display mode
- Time encoded bond profile display mode
- Reference display mode
- Alarm modes: Amplitude, Phase. Halo, square, ellipse ring gates
- High speed swept frequency
- Individually sizeable "ring" gates with alarms
- Compatible with probes from other manufacturers
- Splitscan and Splitview
This instrument uses the most common Pitch-catch (P/C) and Resonance modes that are suited to laminates, bonded and sandwich structures. Pitch-catch is dry coupled, easy to use and works well on larger defects, >0.5". Resonance mode requires couplant, but can identify smaller defects and even determine which layer the defect occurred in with multi-layered bonded structures.
4 Inspection Methods
When a probe is connected to the Bondascope 350, the automatic recognition optimizes the settings for the probe type. There are 4 inspection methods available:
Transmits a short burst of acoustic energy to the part and measures the amplitude and phase change of the received signal directly. A disbond reduces sound attenuation into the part leading to a higher amplitude at the receiver.
Transmits a spike pulse of broadband and acoustic energy into the part and measures the amplitude of the received signal.
Transmits a short burst of acoustic energy to the part across a pre-defined swept frequency range. The system measures the amplitude and phase change of the received signal.
Probe driven at the resonance frequency and the damping caused by contact with the part is analyzed. Defects are identified by a change in the phase and amplitude of the probe resonance caused by a change in acoustic impedance of the part.
Results can be displayed in different modes including live RF envelope or impedance plane display. The Impedance-plane display (flying dot or swept) is a polar coordinate system showing the phase shift and amplitude of the test area compared to a nulled out good bond. A time-encoded profile of phase and amplitude can also be used for rapid scanning.
There is a range of probes available for each inspection method and the system is also compatible with probes from other manufacturers for added functionality.
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- Multi-layered laminates
- Skin to core flaws
- Glass fiber / carbon fiber composites
- Far-side defects
- Honeycomb and foam cores
- Impact damage
- Metal to metal bonding
- Adhesively bonded fittings
- Liquid Ingress
Standard Bondascope 350 Kit Includes:
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- Bondascope 350 Bond Tester
- Pelican style shipping case
- User manual
- NiHM Rechargeable AA Batteries
- AC Charger
- Calibration Certificate
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- Resonance Probes
- Pitch-Catch Probes
- Data Transfer Software and Cable (optional)
- Protective Carrying Case