Baugh & Weedon BondCheck

Baugh & Weedon BondCheck

Accurate, Clear & Simple Bond Testing

The new BondCheck is a multi-mode bond testing flaw detector providing high speed bond inspection in pitch-catch or resonance modes, or mechanical impedance analysis (MIA), with excellent defect sensitivity. Housed in a lightweight instrument (1.2kg), with a common user interface between the three modes, the BondCheck delivers a simple and intuitive operator-led set up. The large daylight-readable display gives the BondCheck operator excellent data presentation and signal resolution, making it a great all round asset for inspection in the laboratory or under cover as well as out in the field. The BondCheck is ideal for a wide spectrum of advanced material NDT of required in the aerospace, automotive, wind energy and advanced manufacturing sectors.




  • Multi-mode Bond Testing instrument
  • Unique calibration function for fast and easy set-up
  • Lightweight & portable
  • Dry coupled Pitch-Catch, Resonance and MIA probes
  • Automatic Test Frequency Optimization
  • Ideal for inspection on metallic bonded structures, composite and metallic honeycomb
  • Sweep, RF, Y/T, Encoded and Phase / Frequency Plots
  • 2 year warranty

BondCheck Modes

Pitch-Catch Mode

Ergonomically designed and manufactured from CNC machined Aluminum with rubber hand grips, the BondCheck Pitch-Catch probe is both comfortable to use and robust; whilst offering the best in performance and durability. The probe feet can be positioned by the user to suit the inspection task, and the hard wearing probe tips are interchangeable with rounded and flat tip profiles available. The probe is broad band and is suitable for a wide range of applications.

Resonance Mode

Resonance mode is ideal for inspection of bonded aluminum lap joints commonly found in aerospace structures such as wing and aileron stiffeners, and has good penetration through multi-layered structures and adhesive bond lines. Available in a number of frequencies (75, 90, 165, 200, 250 and 330kHz), supplied as a 6 probe kit or individually.

MIA Mode

The MIA technique is particularly useful for small defect detection, using a dry coupled probe with a small contact area. The technique offers excellent near surface defect sensitivity and is particularly suitable for top surface skin to core dis-bond detection for composite as well as metallic honeycomb structures.


BondCheck Applications & Probe Selection

Application Probes Used per Application Probes Applicable / Not Applicable per Application
Carbon honeycomb near surface delamination Pitch-Catch (Excellent) & MIA (Good) Resonance is not Applicable
Carbon honeycomb core crush / cut damage Pitch-Catch (Good) & MIA (poor) Resonance is not Applicable
Carbon honeycomb rear surface delamination Pitch-Catch (Good) MIA and Resonance are not Applicable
Metallic honeycomb skin disbond / core damage Pitch-Catch (Good) & MIA (Excellent) Resonance is not Applicable
Metal bonded lap joint Pitch-Catch (Good), Resonance (Excellent), MIA (Good)  
CFRP delamination Pitch-Catch (OK), Resonance (Good), MIA (Good)  
Small defect detection Pitch-Catch (OK), Resonance (Good), MIA (Good)  
Dry Coupling Pitch-Catch & MIA Resonance is not Applicable

Technical Specifications

BondCheck Specifications

Display Type: 5.7" (145mm, 18 bit Color, Daylight Readable 
Viewable Area: 4.5" (115.2mm) Horizontal x 3.4" (86.4mm) Vertical. Resolution 640 x 480 pixels
Color Schemes: User Configurable Dark, Bright and Black & White
Configurable Screen: Full Screen, Single, Dual Pane with Variable Size and Location and Function e.g. XY, Timebase
Display Modes: Pitch-Catch, Resonance & MIA: Spot or Sweep Modes. RF Timebase for Pitch-Catch only.
Graticules: None, Grid (4 sizes: 5, 10, 15 and 20% FSH). Polar (4 sizes: 5, 10, 15 & 20% FSH)
Offset: Spot Position: Y: -50 to 50, X: -65 to 65%
Flip: Manual or Automatic Screen Orientation Change to enable left or right handed use
Transmit Operating Modes: Pitch-Catch, Resonance and MIA
Output Frequency Range: Pitch-Catch: 5kHz to 50kHz. Resonance: 50kHz to 400kHz. MIA: 2kHz to 10kHz.
Output Voltage: Pitch-Catch Tone Burst: 10 ranges: 1, 3, 6, 8, 10, 12, 18, 24, 30, 36V pk.-pk.
Pitch-Catch Sweep: 3 ranges: 12, 24, 36V pk.-pk.
Resonance: 3 ranges: 12, 24, 36V pk.-pk.
MIA: 3 ranges: 12, 24, 36V pk.-pk. (high voltage drive in probe)
Minimum Output Drive Load Impedance: 300 ohms
Waveform Type: Pitch-Catch / MIA Tone burst with rectangular or hanning window with chirp.
  Transmit waveform points maximum: 8192
  Waveform Duration: Pitch-Catch Maximum: 3.2ms / MIA Maximum: 2.5ms
Waveform Output DAC Clock Rate: 2.5MHz fixed
  Frequency Sweep: Frequency range: Pitch-Catch: 5kHz to 50kHz / MIA: 2kHz to 10kHz
Waveform Type: Resonance Fixed or swept waveform
Frequency Range: 5kHz to 400kHz
Receive Specification     Pitch-Catch / MIA Tone Burst: Sample Rate: Pitch-Catch: 440kHz / MIA: 100kHz
Maximum PRF: 14Hz 
Sample Bit Depth: 12 bit
Gain Range: 0 to 60dB
Receive Bandwidth: 5kHz to 100kHz, -6dB
Input Voltage Saturation: +/- 400mV
Time Base Range: Pitch-Catch: 100us to 2ms / MIA: 100us to 22ms;
Cross Talk: >400dB isolation
Time Base Delay: 0us to 1ms
Amplitude / Phase Extraction Cursor: Position Resolution: Pitch-Catch: <5us / MIA: 10us 
Resonance & Pitch-Catch Sweep: Dynamic Range: >150dB
Bit Depth: 24 bit
Gain Range: 30 to 60dB
Receive Bandwidth: DC to 20MHz
Amplitude / Phase Extraction by QAM demodulation
Filtering: Fixed Hardware High-pass filter for Pitch-Catch to reduce surface scanning noise.
Fixed Hardware Low-pass filters 100kHz for Pitch-Catch for optimum amplifier SNR.
Configurable Software High-pass and Low-pass filters for all modes.
Software Acquisition Gate in RF Mode: Adjustable gate start, width and threshold
Alarm Gate in Y/T Mode: Multiple box, circle and sector alarm zones
Calibration Mode: Performs frequency sweep of bond and disbond areas.
Automatic inspection frequency determination with manual adjustment.
Air calibration for resonance mode.
Bond / Disbond Alarm: Status on screen and probe (LED)
Physical Weight: 2.7 lbs. (1.2kg)
Dimensions: 9.4" x 5.7" x 2.1" (237.5 x 144 x 52mm) 
Material / Housing: Aluminum Alloy Mg Si 0.5 powder-coated
Operating Temperature: 32° to 104°F (0° to 40°C)
Storage Temperature: Storage for up to 12 months. -4° to 140°F (-20° to 60°C), Nominal 68°F (20°C)
IP Rating: 54
2 Yr. Manufacturer's Warranty: Covers all components of the BondCheck, excludes customer damage or misuse. (Probes not included)
Pitch-Catch Probe Specifications

Operating Frequencies: 30kHz (suitable for 10kHz to 50kHz)
Transmit - Receive Probe Separation: 0.67" (17mm)
Transmit - Receive Probe Linear Travel: >0.20" (5mm)
Probe Auto-Recognition: Yes
Probe Alarm LED: Yes
Probe Feet: Multiple Positions, user changeable
Probe Tips: Rounded end and flat end, replaceable by user
Probe Materials: Anodized aluminum case, with stainless steel probe housings, rubber finger grip
One-wire integrated memory for serial number and settings.
Resonance Probe Specifications

Operating Frequencies: 75, 90, 165, 200, 250 and 330kHz
Transducer Face: 0.59" (15mm) for >150kHz
0.91" (23mm) for <150kHz
Probe Auto-Recognition: Yes
Probe Alarm LED: Yes
Probe Material: Polymer handgrip, Stainless Steel probe with alumina wearface
Probe Connector: LEMO:ECG.1B.308.CLV
One-wire integrated memory for storing serial numbers, air calibration and user settings.
MIA Probe Specifications

Operating Frequencies: 2kHz to 10kHz 
Probe Auto-Recognition: Yes
Probe Alarm LED: Yes
Probe Housing Material: Polymer 
Probe Connector: LEMO: ECG.1B.308.CLV 
One-wire integrated memory for serial number and user settings.


BondCheck Kit Includes:

  • BondCheck Unit
  • AWEL002: Power Adapter & Input Plugs (UK, EU, US & AUS)
  • AWEL003: Adjustable Padded Shoulder Strap, Quick Release Clips
  • AC006: Instrument Soft Carrying Case
  • A090: USB Cable - A to Mini B, 1m (RoSH Compliant)
  • 40835: Quick Reference Card - BondCheck
  • ALL10-L08_015_BON: Lead, LEMO 10-Way / LEMO 8-Way, 1.5m (to fit BondCheck Pitch-Catch & Resonance Probes)

BondCheck Probe Kits

Pitch-Catch Probe Kit Includes:

  • Pitch-Catch Probe for Bond Testing
  • ALL10-L08-015-BON: Lead, LEMO 10-Way / LEMO 8-Way, 1.5 m
  • AC002: Deluxe Probe Case

Resonance 6 Probe Kit Includes:

  • PETH075 Probe, Resonance, 75 kHz
  • PETH090 Probe, Resonance, 90kHz
  • PETH165 Probe, Resonance, 160kHz
  • PETH200 Probe, Resonance, 200kHz
  • PETH250 Probe, Resonance, 250kHz
  • PETH330 Probe, Resonance, 330kHz
  • ALL10-L08-015-BON: Lead, LEMO 10-Way / LEMO 8-Way, 1.5 m
  • AC012: Hard Carrying Case

MIA Probe Kit Includes:

  • PETHMIA Probe
  • ALL10-L08-015-BON: Lead, LEMO 10-Way / LEMO 8-Way, 1.5 m
  • AC012: Hard Carrying Case

Product Literature

Description Part # Saved Price Select Option Add to
Baugh & Weedon BondCheck Includes: Unit, Power Adapter & Input Plugs, Adjustable Padded Shoulder Strap, Quick Release Clips, Soft Carrying Case, USB Cable - A to Mini B-1m, Quick Reference Card, LEMO 10-Way / 8-Way Lead - 1.5m BT-BW-KIBON001 Request Pricing
Baugh & Weedon Pitch-Catch Probe Kit Includes: Pitch-Catch Probe for BondCheck, LEMO 10-Way / 8-Way Lead - 1.5m, Deluxe Probe Case BT-BW-KAETH001 Request Pricing
Baugh & Weedon Resonance 6 Probe Kit Includes: 75, 90, 160, 200, 250 & 330kHz Probes, LEMO 10-way / 8-Way Lead - 1.5m, Hard Carrying Case BT-BW-KAETH002 Request Pricing
Baugh & Weedon MIA Probe Kit Includes: MIA Probe, LEMO 10-Way / 8-Way Lead - 1.5m, Hard Carrying Case BT-BW-MIA-PROBE-KIT Request Pricing